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THERMAL GAP FILLER, SILICONE, low viscosity - 8327GF25

THERMAL GAP FILLER, SILICONE, low viscosity - 8327GF25

MG Chemicals
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8327GF25 - Thermal Gap Filler, Silicone

8327GF25 is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. 8327GF25 can be used as a liquid alternative for prefabricated solid thermal pads.

If higher thermal conductivity is desired, use 8327GF41.

Features and Benefits

  • Thermal conductivity of 2.5 W/m•K
  • Quick low-temperature cure
  • 1:1 mix ratio
  • Flame retardant—meets UL 94V-0
  • Reworkable