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Medium Cure Thermally Conductive Adhesive, Flowable, 8329TFM-25ML

Medium Cure Thermally Conductive Adhesive, Flowable - 8329TFM-25ML

MG Chemicals
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8329TFM - Thermal Adhesive, Flowable

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates.

This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems.

For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

Features and Benefits

  • Thermal conductivity of 1.1 W/(m·K)
  • 1:1 mix ratio
  • Working life: 45 minutes
  • Cure time: 24 hours at room temperature or 2.5 hours at 65 °C (149 °F)
  • Provides strong electrical insulation
  • High tensile
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
  • Shelf life: ≥3 years
  • RoHS 3 compliant