4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no-clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

Applications and Uses

4900P solder paste is designed to facilitate high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as to 0.3 mm.