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LEADED NO CLEAN SOLDER PASTE, 4860P-35G

LEADED NO CLEAN SOLDER PASTE - 4860P-35G

4860P-35G
Vendor
MG Chemicals
Regular price
$25.95
Sale price
$25.95
Regular price
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4860P - Sn63/Pb37 No Clean Solder Paste

4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Applications and Uses

This solder paste is designed for use in high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features and Benefits

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Non-corrosive
  • Non-conductive residue
  • Halide free
  • Good wettability
  • Type 3 (45-25 µm)