High thermal conductivity High dielectric constant High dissipation factor Use with heat sinks or metal chassis Will not dry or harden ` Contains zincs oxides and polydimenthyl siloxane Meets MIL-DTL-47113D Non-silicone version available Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.